Introducing Semiconductor Digest

Welcome to Semiconductor Digest, a new business-to-business publication focused on the dynamic semiconductor manufacturing industry. I’ll be using my 37 years of publishing experience – 25+ years at Semiconductor International and 11+ years at Solid State Technology – to deliver useful information to a worldwide audience of engineers and executives.

Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Our focus is on the unique requirements of each of these devices in terms of the design tools, process equipment and materials, and test equipment.

The semiconductor industry is in a new era of growth, driven by a diverse array of applications and new computing architectures. Much of this growth will come from the need for better connectivity and more intelligent data analysis using artificial intelligence (AI). AI represents a market opportunity $2 trillion of on top of the existing $1.5-2B information technology industry. Making AI semiconductor engines will require a wildly innovative range of new materials, equipment, and design methodologies. Moore’s Law seems to be slowing, so chips designed for AI and more traditional applications will likely include advanced packaging/heterogeneous integration (think chip stacking) and silicon photonics.

The market for semiconductor manufacturing equipment and materials is huge. Worldwide sales of semiconductor manufacturing equipment surged 14 percent from $56.62 billion in 2017 to an all-time high of $64.5 billion in 2018, according to SEMI. The market for materials is roughly equivalent.

In addition to AI chips from traditional IC companies such as Intel, IBM and Qualcomm, more than 45 start-ups are working to develop new AI chips, with VC investments of more than $1.5B -- at least five of them have raised more than $100 million from investors. Tech giants such as Google, Facebook, Microsoft, Amazon, Baidu and Alibaba are also developing AI chips. AI will be paired with new computational methods (non Von Neumman), such as neuromorphic methods that mimic how the brain works, and quantum computing. Faster communication with higher bandwidth will be required. 5G wireless communication is coming, as is improved WiFi, near-field communication, Bluetooth and satellite communication. Huge opportunities exist in automotive electronics, as autonomous driving moves closer to reality. Virtual reality will be combined with AI to create a truly immersive experience that mankind has never experienced. Semiconductors and AI will play an increasingly important role in the healthcare industry, as diagnostic tools and patient monitoring.

I’m looking forward to working with you on this exciting new journey!

Pete Singer, Editor-in-Chief


Semiconductor Digest Editorial Staff

Pete Singer, Editor-in-Chief


Pete oversees the editorial operations of Semiconductor Digest. He has been involved in technical journalism for 37 years and has written hundreds of articles on all aspects of semiconductor manufacturing and related industries. Pete holds a degree in Electrical Engineering from the University of Illinois, Champaign-Urbana, and is a member of the IEEE, Electrochemical Society, American Vacuum Society and Materials Research Society.

Shannon Davis, Web Editor


Shannon writes, edits and produces Semiconductor Digest's news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Ed Korczynski, Senior Technical Editor

Ed Korczynski is also Sr. Technology Analyst of TECHCET tracking patterning materials and a consultant for IC, LED, and MEMS manufacturing based on over 30 years of experience in Silicon Valley. He managed $10M annual business in China and Korea for Applied Materials, and applications and marketing for Watkins-Johnson, Samco, TruSi, PDF Solutions, UltraClean Technology, and Intermolecular. Previously, he engineered fab processes for the world’s first commercial MEMS accelerometer featuring TSV and WLP, and sustained LED HVM while developing metrology/inspection systems to boost absolute yield 2%. As technical editor with Solid State Technology magazine he won two ASBPE awards and launched Ed’s Threads in 2006 as the first IC industry blog. He holds a B.S. in materials science and engineering from MIT, and one patent.

Dave Lammers, Contributing Editor

Dave Lammers started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined EE Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.

John Blyler, Contributing Editor

John has many years of technical and editorial experience in the semiconductor, electronics, and system engineering spaces. Currently, he is the founder and CEO of JB Systems, a high- tech media, education and engineering company. Previously, John was the editor-in-chief of Chip Design and Semi-Manufacturing Design (SemiMD) magazines. His works have appeared in numerous publications and with several companies including the IEEE, Informa-Penton (Electronic Design), Photonics Media, Wiley, Elsevier, Networking World, Edutopia (George Lucas Foundation), Mentor, Cadence, Synopsys, Intel, Arm, Mouser, Digikey, TI Jama Software, Dassault Systemes, Siemens and many others. John teaches systems engineering and IOT Design as an affiliate professor at Portland State University and an online lecturer at Univ. of California at Irvine. He holds a BS in Engineering Physics from Oregon State Univ. and an MS in Electronic Engineering from Cal. State Univ., Northridge.

Lynnette Reese, Contributing Editor

Lynnette Reese has a B.S. in Electrical Engineering from LSU and has authored over a hundred different articles and blogs about embedded technology. Formerly Editor-in-Chief of Embedded Systems Engineering and Embedded Intel® Solutions, she’s now freelancing. Lynnette has worked for TI, Freescale, Cypress Semi, Mouser Electronics, and Johnson Controls in roles covering industrial controls, Life Safety Systems for fab processes, op amps, USB, microcontrollers, software development tools, and the PowerPC ecosystem. Her favorite topics are AI, IoT, sensors, robotics, autonomous vehicles, semiconductor technology, and any emerging electronics-related technology.

Dick James, Contributing Editor

Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. For over 20 years he worked with Chipworks (now TechInsights), an Ottawa, Canada-based specialty reverse engineering company, and is now Fellow Emeritus with the company. He is also a Senior Analyst for TechSearch International, based in Austin, a leading consulting company in the field of advanced semiconductor packaging technology.

Semiconductor Digest Magazine Editorial Calendar

June* Space 5/24, Materials 5/28

SEMICON West Preview

Artificial Intelligence

On-chip Interconnects

Advances in 5G


July* Space 6/19, Materials 6/21

SEMICON West Show Issue

Smart Manufacturing

Heterogeneous Integration



Aug/Sep Space 8/23, Materials 8/27



Fan-out Wafer Level Packaging



October Space 9/18, Materials 9/20

Defect Detection

Wafer Processing

Advances in Vacuum

Contamination Control


Nov/Dec Space 11/20, Materials 11/22


Advanced Packaging

Neuromorphic Computing

AI in Semiconductor Manufacturing


January 2020 - deadlines TBD

2020 Forecast

Sub-5nm Devices


3D Integration

*Digital edition sent to 40k+; includes bonus print distribution at SEMICON West

Semiconductor Digest Circulation

Among the 40,000+ qualified recipients of Semiconductor Digest magazine, 100% are involved in purchasing decisions.

The readers represent:

  • Merchant/captive manufacturers
  • Foundries
  • Consortiums
  • Manufacturers of semiconductors, ICs, hybrid circuits, custom ICs, semi-custom ICs and ASICs, MEMS, displays, power electronics and LEDs
  • Materials manufacturers
  • IC and semiconductor packaging houses
  • Independent research and development labs
  • Government, military and education institutions
  • Other non-semiconductor manufacturers using thin-film technologies

Semiconductor Digest Geography

2019 Semiconductor Digest Magazine Rates*

*All rates quoted in net

Product Showcase: $1,500 per issue

  • 1/6 page ad in the product showcase section
  • Includes image and link on website in Featured Products section
  • Includes link in The Semiconductor Daily Digest
  • We create the ad for you


Front Cover Package

Occupy the most prominent position and get maximum exposure in the magazine with the front cover promotional package. Package includes:

  • Cover image
  • 2-3 pages of editorial
  • Full page display ad
  • PDF of cover and article

Rate quoted upon request.


SEMICON West and SEMICON Europa Trade Show Incentive Packages

Semiconductor Digest's Trade Show Packages are designed to give your company maximum exposure at the industry’s main events. Display advertisers in pre-show and show issues will receive a second ad of the same size or an upgrade to double the original size in the show issue.

Offer is available for the June and July issues (SEMICON West) and for the August/September and October issues (SEMICON Europa).

Example #1

  • June issue - pay for a 1/2 page ad: $3,400
  • July issue - pay for a 1/2 page ad: $3,400
  • Choose either an additional 1/2 page ad or upgrade to a full page at no additional charge

Example #2

  • June issue - pay for a 1/4 page ad: $2,100
  • July issue - pay for a 1/4 page ad: $2,100
  • Choose either an additional 1/4 page ad or upgrade to a 1/2 page at no additional charge

*All rates quoted in net

Additional SEMICON West Opportunities

SEMICON West Show Daily Magazine

The Show Daily Magazine is back and will be distributed electronically each day of the show with fresh editorial written by our editorial team. Readers can choose to read it on their phones, tablets or computers when it's convenient for them.


  • Sent in a dedicated email to 50k+ each day of the show
  • Featured in the Show Daily Electronic Newsletter which will be sent out each day of the show to 50k+ in addition to the entire SEMICON West attendee list
  • Featured on the Semiconductor Digest Homepage

Prices for ALL three issues:

Outside Back Cover: $6,500 net

Inside Cover: $5,000 net

Front Cover Strip: $6,000 net

Center Spread: $10,000 net

Two-page Spread: $8,000 net

Full Page: $4,500 net

Half Page: $3,000 net

One-quarter Page: $2,000 net


SEMICON West Featured Products Electronic Newsletter - July 8, 2019

Circulation: 50k+

Product Listings: $750 net each

Leaderboard (728x90): $1,500 net

Skyscraper (180x600): $1,500 net

Rectangle (180x150): $750 net (limited availability)


SEMICON West Show Daily Electronic Newsletter (all 3 days) - July 9-11, 2019

Circulation: 50k+ each day of the show and to the entire SEMICON West attendee list

Leaderboard (728x90): $2,500 net

Skyscraper (180x600): $2,500 net

Middle 1 (300x250): $1,800 net

Middle 2 (300x250): $1,600 net

Right 1 (180x150): $1,800 net

Right 2 (180x150): $1,400 net

Right 3 (180x150): $1,200 net

Right 4 (180x150): $1,000 net


SEMICON West Video Package

Circulation: 50k+

  • Promote a new product or announcement on camera at SEMICON West
  • Your video will be recorded at the event then posted on the Semiconductor Digest website. It will also be promoted in our post-show electronic newsletter in August to over 50k manufacturing decision-makers
  • You will receive a copy of the video to post on your site, post on YouTube or use for any other marketing purpose as you please

Rate is $2,500 net per video


Email Blasts

Drive traffic to your booth! Beginning in June, we will send an email on your behalf to a targeted portion of our database to meet your budget and objectives. CPM of $200.

Electronic Newsletters

Semiconductor Daily Digest - Current News

Monday - Friday (except holidays); Circulation: approximately 22k

Text sponsorships available by the week:

  • Sponsor #1: $995 net per week
  • Sponsor #2: $850 net per week
  • Exclusive: $1,500 net per week


Topical Newsletters

Semiconductor Digest Website Banners

Display your banner campaign - either branding or for lead generation on the Semiconductor Digest website - on one of the many relevant channels. Channels and rates listed below. All rates are quoted in net.

Advertising Contacts

Kerry Hoffman, Publisher




For Germany, Austria, E. Switzerland & E. Europe,

Holger Gerisch, Sales Manager




Gold Flag Media, 58 Summer Street, Andover, MA 01810

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