SMART's MIP, operating up to DDR4-3200, is an ideal solution to replace multiple down-board DRAMs or SO-DIMMs to maximize DRAM density within minimal board space. Additional advantages of the MIP:
− Compared to solder down approaches, main board routing complexity is greatly reduced by avoiding the need for back-to-back chip placements. Plus, the MIP contains all necessary passives and a thermal sensor, eliminating the need to place these components.
− Removes the need for a mating connector, resulting in better signal integrity and reduced flight time.
- Better flexibility over die stacking and packaging solutions
− Build-to-order model with multiple standard DRAM sources available.
The MIP leverages SMART’s extensive stacking technology into new markets and new applications. It addresses OEMs’ need for faster memory in space-saving cube-computing applications for networking, telecom and embedded markets..
The 16GB MIP is available in two configurations, the standard 1Gx64 version or the two channels of x32 configuration to replace either soldered down DRAMs or SO-DIMMs. The MIP is an ideal solution for MCU, CPU, or FPGA-based embedded computing and IIoT systems that require a x64 or x32 memory access. For example, a small form factor COMe system for IIoT can be populated with 128GB of memory using four 16GB MIPs on the top of the system and four 16GB MIPs mirrored on the bottom.
SMART offers a full lineup of MIPs, 4GB to 16GB with speeds up to DDR4-3200.
To learn more about SMART’s MIP please visit www.smartm.com/mip.
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