Loading

WaveTherm Corporation Superior thermal and structural performance for embedded applications

WaveTherm Corporation is an international, standards-centric products OEM supplier of mechanical and thermal COTS products and application-specific design solutions.

Heatframes, wedgelocks, and injector-ejectors

Conduction-cooled heatframes, wedgelocks, and injector-ejectors, are mechanical assemblies, and components which perfectly match the component topography and requirements of a PCB intended for an embedded computing host environment. Wedgelocks are utilized to secure the PCB in its' deployed system level enclosure, provide structural rigidity to the module assembly, and serve as a path for thermal transfer to the chassis cold wall of the deployed enclosure for effective cooling of the PCB and critical electronic components. The injector-ejectors enable the user to safely insert and extract the PCB module, and are driven by requirements derived from international standards.

3U VPX Conduction-Cooled Exploded Assembly
3U Conduction-Cooled Enclosure
WaveTherm's SolidWedge wedgelocks represent a decisive advancement in the mechanical packaging of critical embedded systems. Higher thermal performance, higher clamping force, and the world's only wedgelock retainer that features positive retraction.

Conduction Product Lines

Competitive Advantages

  • COTS products for VITA 48.2, 78, 78.1, 48.4, 48.5
  • Positive Retraction
  • Superior Thermal Performance
  • Superior Clamping Force and Longevity
  • Zero Insertion Force
  • Low Profile

Multiple Styles

  • Side-Strap
  • Center-Strap
  • Interlocking Wedge Segments

.375" Magnum Animation

Audio on

Secondary-Side Pass-Thru SolidWedge

HW5 Hybrid SolidWedge

Hybrid-Cooling Effect

Superior Thermal Cross-Sectional Area
Superior Clamping Force

SolidWedge & Hybrid SolidWedge enable breakthrough thermal performance at board and system level

The fundamental design attributes which distinguish the SolidWedge from the competition are the positive drive mechanism and thermal benefits derived from the physical absence of a long drive screw required for operation. Hybrid Cooling is the simultaneous conduction and convection-cooling of the module and is uniquely optimized by the Hybrid SolidWedge as air can be blown through a wedgelock with no long drive screw to obstruct air flow.
WaveTherm's 3U, 6U, and custom injector-ejector products are widely respected for their compact size, ergonomic style, robust functionality, and field replaceability.

Injector-Ejectors

VITA 48.2, 78, 48.4, 48.5

Low Profile Injector-Ejectors

Hex Key Injector-Ejectors

  • Tool reduction to maintainer due to common hex size on wedgelocks and captive screw injector-ejectors
  • Maximum Insertion-Extraction force 120lbs

Variable Force Injector-Ejectors

Injection Force Test Video

WaveTherm's patented Variable Force Injector-Ejector products are currently the only known COTS injector-ejector products to achieve the necessary injection forces required to install high-end, pressurized, liquid flow-thru VITA 48.4 modules. This significant engineering achievement enables the WaveTherm VFE to lock out competition in higher-end systems, and foretells a continued high profit margin and competitive advantage in this niche market for the decades to come.
Based on international open standards, OpenCOTS reference designs facilitate rapid design-in of WaveTherms' premium, standard COTS products and advance our mission to support the customer with industry leading mechanical packaging knowledge. These products sales offer WaveTherm a unique vantage point, and opportunity, to gain early-stage intelligence into programs with follow-on opportunities for high value-added services.
Wedgelock Orientation Thermal Design Guide
Wedgelock Orientation Thermal Design Guide
OpenCOTS PCB Reference Designs for Precision Conduction-cooled Design
PCB Reference Design w/o Connectors
Rugged Design Kits
Based on international open standards, OpenCOTS reference designs facilitate rapid design-in of WaveTherms' premium, standard COTS products and advance our mission to support the customer with industry leading mechanical packaging knowledge. These products sales offer WaveTherm a unique vantage point, and opportunity, to gain early-stage intelligence into programs with follow-on opportunities for high value-added services.

Shock and Vibration Test Fixture for 3U, and 6U conduction-cooled VPX

Shock and Vibe Base Plate and Conduction-cooled Rails(RTM and Air-Cooled Rails sold as separate sub-assemblies)

Conduction-cooled Thermal Load Board Module

3U VPX Thermal Load Board for downstream thermal design integration to 3rd party modules for pre-deployment module design refinement purposes to insure easy integration into eventual deployed environment.

3U and 6U Thermal Test Enclosures

6U VPX Thermal Lab Test Enclosure
3U & 6U VPX Shock and Vibration Test Fixture
Shock and Vibration Schematic
Conduction-Cooled Thermal Load Board Module
Thermal Load Board Module
6U Thermal Load Board

Hybrid VPX

Hybrid VPX combines the greater cooling capacity of convection cooling with the ruggedness and thermal transfer of conduction cooling. WaveTherm's Hybrid VPX design approach utilizes the module’s finned surface area for cooling which, when combined with the conductive cooling contribution, provides a greatly increased cooling effect.
Existing, standard‐sized 3U and 6U VPX boards are enclosed in an internally sky‐lined clamshell for any required component‐to‐metalwork interface, and feature cross‐flow cooling fins on both the upper and lower covers. Designers can select from wedgelocks that either maximize air flow(3 Segment Hybrid SolidWedge), or maximize the conduction characteristics of the module and/or system(5 Segment Hybrid SolidWedge).
The inherent thermal conduction path that is created between modules once they are installed with their respective wedgelocks engaged, facilitates thermal load sharing between PCB module assemblies so that a high‐powered module can take advantage of the finned air cooling area of adjacent lower‐powered modules, and thus operate as if it has considerable, additional surface cooling area than it possesses independently. Heat pipes can be integrated into enclosure/chassis cold walls to hasten the thermal transfer between modules as well, and can be extended above and/or below the card cage to take advantage of additional heat sinking areas such as finned heat sinks or external cooling surfaces or thermal paths such as a cold plate.
Modules can be environmentally sealed in their cooling fin area with gaskets sealing at both the rear of the module and at the front faceplate. This would allow “dirty air” to be used for cooling of the module while isolating both the backplane and front wiring cavities from external contaminants.
Embedded Heatpipes Hasten Thermal Equilibrium
Cut-Away Look
MicroTCA.3 Single-Wide Schematic
MicroTCA.3 Pitch Line Determined by WaveTherm
Available Area Illustration 3U VPX and MicroTCA.3

MicroTCA.3 Single Wide Module Schematic

MicroTCA.3 Single Wide Module Schematic
MicroTCA.3 Double-Wide Schematic

truCOTS MicroTCA.2 RDK's

TC-AC-4HP-SW

MicroTCA.2 AMC Module Development Test Chassis

MicroTCA.2 and .3 Backplane Schematic

MicroTCA.3 Angled-Fin Thermal Test Chassis

Light Weight MicroTCA.3 ATR

Cut Away Look
Module Extraction

Rugged Enclosure and Commercial Chassis

Standards we design to:

  • ANSI-VITA
  • PICMG
  • cPCI
  • MicroTCA.2
  • MicroTCA.3
  • FIPS
  • NEMA
12-Slot MicroTCA.1 Telecom Chassis
Mechanical and Thermal Design for Electronic Warfare Applications
Sealed, 3U VPX Enclosure
Sealed, 3U VPX Enclosure Side View

Company, Brand, & IP Historical Image Compilation

SOUND ON!

Thank you !!

Contact

212 Powell Drive, Suite 112

Raleigh, NC 27606

Phone - 919.307.8071

Email - sales@wavetherm.com

Created By
Josh Jenkins
Appreciate