Hybrid VPX combines the greater cooling capacity of convection cooling with the ruggedness and thermal transfer of conduction cooling. WaveTherm's Hybrid VPX design approach utilizes the module’s finned surface area for cooling which, when combined with the conductive cooling contribution, provides a greatly increased cooling effect.
Existing, standard‐sized 3U and 6U VPX boards are enclosed in an internally sky‐lined clamshell for any required component‐to‐metalwork interface, and feature cross‐flow cooling fins on both the upper and lower covers. Designers can select from wedgelocks that either maximize air flow(3 Segment Hybrid SolidWedge), or maximize the conduction characteristics of the module and/or system(5 Segment Hybrid SolidWedge).
The inherent thermal conduction path that is created between modules once they are installed with their respective wedgelocks engaged, facilitates thermal load sharing between PCB module assemblies so that a high‐powered module can take advantage of the finned air cooling area of adjacent lower‐powered modules, and thus operate as if it has considerable, additional surface cooling area than it possesses independently. Heat pipes can be integrated into enclosure/chassis cold walls to hasten the thermal transfer between modules as well, and can be extended above and/or below the card cage to take advantage of additional heat sinking areas such as finned heat sinks or external cooling surfaces or thermal paths such as a cold plate.
Modules can be environmentally sealed in their cooling fin area with gaskets sealing at both the rear of the module and at the front faceplate. This would allow “dirty air” to be used for cooling of the module while isolating both the backplane and front wiring cavities from external contaminants.